Ministry of Commerce of the People's Republic of China 
The 2026 Japan Osaka Integrated Circuit and Sensor Packaging Expo (IC & Sensor Packaging Expo Japan - Osaka) will take place from May 13 to 15, 2026, at Intex Osaka in Osaka, Japan. As Asia's leading exhibition for the final manufacturing of integrated circuits (ICs), the event brings together advanced equipment, materials, and services, covering semiconductor assembly equipment, packaging materials and equipment, analysis and simulation software, plating and etching materials and equipment, and more. The exhibition provides engineers and professionals from industries such as semiconductors, sensors, electronic components, and automobiles with a platform for networking and business negotiations. Technical seminars led by industry experts will also be held to discuss the latest packaging technologies and market trends. Intex Osaka, as Osaka's major international exhibition center, features state-of-the-art facilities, convenient transportation, and well-developed surrounding infrastructure, providing excellent conditions for the smooth operation of the exhibition.
Date
- 2026.05.13-05.15
- 05.2027
- Founded in: /
- Interval: Once a year
Venue
- Intex Osaka
- Japan-Osaka
- Opening Hours: /
Industry
- Industry Sector
- Testing, Measuring and Analyzing, Precision Mechanics,Electric and Electronics (Products, Machinery)
- Main Product Groups
- Electronic Design & Components Measurement, Control & Testing
Sponsor
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