The IC&SENSOR PACKING EXPO JAPAN CHIBA 2025, as the leading integrated circuit (IC) final manufacturing technology exhibition in Asia, will be held from September 17 to 19, 2025 at the Makuhari Messe Nippon Convention Center in Chiba, Japan. This exhibition focuses on showcasing advanced equipment, materials, and services in the field of IC packaging, including assembly equipment, packaging materials/equipment, and analysis/simulation software. It provides an important platform for professionals in the IC packaging industry to communicate and collaborate, aiming to promote technological innovation, explore new business opportunities, and promote the development of the entire IC packaging technology field.