The IC & SENSOR PACKAGING EXPO JAPAN - NAGOYA 2025 is Asia's leading professional exhibition in the field of integrated circuit (IC) final manufacturing. It will take place from October 29 to 31, 2025, at the Nagoya International Exhibition Center (Port Messe Nagoya) in Japan. The exhibition showcases advanced equipment, materials, and services, with exhibits covering assembly equipment, packaging materials and equipment, and analysis/simulation software for IC packaging. The Nagoya International Exhibition Center is a modern exhibition facility with convenient transportation, located just a 5-minute walk from Omi Fuji Station. The exhibition not only provides exhibitors and visitors with opportunities for in-depth understanding and exchange but also promotes industry collaboration and cooperation through a variety of concurrent events.