The 2026 Japan Osaka Adhesion and Joining Technology Exhibition (JOINING JAPAN - ADHESION & JOINING EXPO - OSAKA) will take place from May 13 to 15, 2026, at Intex Osaka in Osaka, Japan. As an internationally leading exhibition for adhesive and joining technologies, the event showcases adhesives, adhesive films, tapes, joining equipment and technologies, surface treatment equipment, testing, measurement, and analysis technologies, among others. JOINING JAPAN - ADHESION & JOINING EXPO brings together leading companies from around the world, providing manufacturers, engineers, R&D personnel, and procurement professionals with a platform to learn about the latest adhesive and joining technologies, exchange experiences, and explore collaboration opportunities. Intex Osaka, as Osaka's major international exhibition center, features state-of-the-art facilities, convenient transportation, and well-developed surrounding infrastructure, providing excellent conditions for the smooth operation of the exhibition.