Ministry of Commerce of the People's Republic of China 
From January 21 to 23, 2026, the IC & SENSOR PACKAGING EXPO JAPAN - TOKYO 2026 will be held at the Tokyo Big Sight International Exhibition Center in Tokyo, Japan. As Asia's leading exhibition for integrated circuit (IC) packaging manufacturing, the event brings together advanced equipment, materials, and services, including assembly equipment, packaging materials and equipment, as well as analysis/simulation software for IC packaging. IC & SENSOR PACKAGING EXPO JAPAN 2026 provides industry professionals with a platform to showcase the latest technologies and expand their business networks, driving innovation and development in the IC packaging industry. Tokyo Big Sight is one of Japan's largest international exhibition centers, featuring state-of-the-art facilities and convenient transportation access.
Date
- 2026.01.21-01.23
- 01.2027
- Founded in: /
- Interval: Once a year
Venue
- Tokyo International Exhibition Center (Tokyo Big Sight)
- Japan-Tokyo
- Opening Hours: /
Industry
- Industry Sector
- Testing, Measuring and Analyzing, Precision Mechanics,Manufacturing Technology and Engineering
- Main Product Groups
- Electronic Design & Components Measurement, Control & Testing
Sponsor
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